Thick Film Sensors by Prudenziati, M.(eds.)

By Prudenziati, M.(eds.)

This article explores thick-film know-how. It identifies the functions of thick-film sensors and actions within the improvement of units. Hybrid circuits for sign processing; production of architectural constructions; and transducing components derived from thick-film pastes are coated.

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The packaging in which the devices are presented varies, but the four most popular types are: small outline, plastic chip carrier, flat pack and ceramic chip carrier. The small outline (SO) device is essentially a miniature version of the dual-in-line (DIL) package but differs in that the leads are formed in the plane of the substrate rather than perpendicular t o it. The SO device is shown in figure 11 (b). 27 mm and therefore higher pin count ICs are not packaged in this way owing t o the increase in physical size.

Once the chip is held firmly in position it is ready for wire bonding. The three most common methods are: (1)Thermocompression, (2) Ultrasonic, (3) Thermosonic. Capillary Wire i ( a ) B a l l bond (b) Stitch bond ( c ) Wedqe b o n d Figure 14. Illustration of the main types of wire bond. 27 It is important to select the appropriate conductor ink for the bond pads as not all inks are compatible with each wire bonding method. Essentially, there are three main types of wire bond; the ball, stitch and wedge.

Solder dipping involves immersing the substrate into a pot of molten solder whose temperature is around 200 OC. The time in which the circuit is left in the pot needs to be optimised to obtain adequate wetting of the substrate whilst minimising leaching effects. The rate at which the substrate is withdrawn from the solder influences the thickness of the solder coating. Wave soldering requires the use of a flow solder machine. The substrates are held in position on a continually moving belt component side down.

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