By Michael Orshansky
Design for Manufacturability and Statistical layout: A confident Approach presents a radical remedy of the factors of variability, tools for statistical information characterization, and methods for modeling, research, and optimization of built-in circuits to enhance yield. the target of the optimistic strategy built during this publication is to formulate a constant set of tools and ideas precious for rigorous statistical layout and layout for manufacturability from machine physics to large-scale circuit optimization. The segments of the ebook are dedicated, respectively, to
- understanding the factors of variability;
- design of attempt buildings for variability characterization;
- statistically rigorous info analysis;
- techniques of layout for manufacturability in lithography and in chemical mechanical polishing;
- statistical simulation, research, and optimization concepts for bettering parametric yield.
Design for Manufacturability and Statistical layout: A positive Approach provides an outline of the tools that have to be mastered for state of the art layout for manufacturability and statistical layout methodologies. it really is an immense reference for practitioners and scholars within the box of computer-aided layout of built-in circuits.
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Extra resources for Design for Manufacturability and Statistical Design: A Constructive Approach
Result in bowing of the trench structure). The local etch rate and thus over-etch time may depend strongly on layout pattern: the local or regional pattern density, as well as the aspect ratio of features being etched, means that diﬀerent regions on the chip and diﬀerent feature sizes may induce complex variations in the patterned trench width.
A well known dependence is on the pattern density of features: regions with higher area fraction or pattern density of raised features will take longer to polish than areas where only a small volume of material needs to be removed. In the copper damascene process, however, the presence of three materials – copper, barrier metal, and dielectric – means that selectivity during diﬀerent steps or stages of the removal can play a critical role. In particular, the line spacing can be very important in “holding up” the polishing pad and preventing or limiting dishing.
The impact of the above physical mechanisms is to change the properties of devices over time. The diﬀerence is that the manufacturing and intrinsic variations are manifest at time zero, while the “temporal” variations appear over time. From the designer’s point of view, the impact of these changes is not diﬀerent from the variability induced by the manufacturing process: the impact of both is to introduce uncertainty about the device properties. The traditional approach designers use to deal with these two types of variability mechanisms is also the same - to use margins and worst-casing.