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This completely revised and up-to-date 3 quantity set is still the normal reference within the box, offering the most recent in microelectronics layout tools, modeling instruments, simulation thoughts, and production strategies. in contrast to reference books that spotlight basically on a couple of features of microelectronics packaging, those notable volumes talk about state of the art applications that meet the facility, cooling, security, and interconnection requisites of more and more dense and quick microcircuitry. offering a good stability of conception and sensible functions, this dynamic compilation gains step by step examples and very important technical info, simplifying each one section of package deal layout and construction. moreover, the volumes comprise over 2000 references, 900 figures, and 250 tables.
Part I: know-how Drivers covers the motive force of microelectronics packaging - electric, thermal, and reliability. It introduces the know-how developer to points of producing that needs to be thought of in the course of product improvement.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the 1st point of packaging and all first point applications. electric attempt, sealing, and encapsulation applied sciences also are coated intimately.
Part III: Subsystem Packaging explores board point packaging in addition to connectors, cables, and optical packaging.